RED Beet 2.0
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RED Beet 2.0
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White BEET
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Powerline chip | QCA7006AQ | QCA7006AQ | QCA7005-AL33 |
Firmware version | Qualcomm HomePlug GreenPHY FW v3.3 | Qualcomm HomePlug GreenPHY FW v3.3 | Qualcomm HomePlug GreenPHY FW v3.0 |
Configuration | EVSE (Electric vehicle charging stations) | PEV (Plug-in electric vehicles) | E-mobility Bridging/SLAC software as a closed system E-mobility ISO 15118 / DIN 70121 / SAE J2847/2 stack software as a closed system E-mobility SDK Open (no embedded firmware) |
Host Interface | SPI Ethernet (Integrated 10/100 802.3az Ethernet PHY) | SPI Ethernet (Integrated 10/100 802.3az Ethernet PHY) | ETH / SPI |
Mains Coupling | Yes, for DVK* only | Yes, for DVK* only | ZC detector |
Max data rate | 9.8 Mbps PHY rate / 4.6 Mbps payload with HPGP Firmware 200 Mbps PHY rate / 94 Mbps payload with HPAV Firmware | 9.8 Mbps PHY rate / 4.6 Mbps payload with HPGP Firmware 200 Mbps PHY rate / 94 Mbps payload with HPAV Firmware | 9.8 Mbps PHY rate / 4.7 Mbps UDP data rate; |
Overvoltage protection | N/A | N/A | 4 kV |
Max distance | According to ISO/IEC 15118-3 | According to ISO/IEC 15118-3 | According to ISO/IEC 15118-3 |
Power Supply | 3.3V | 3.3V | 3.3V |
Power Consumption | 1W (at 25º C) | 1W (at 25º C) | 1W (at 25º C) |
Temperature Range | -40º C to +105º C (board temperature) | -40º C to +105º C (board temperature) | -40º C to +105º C (board temperature) |
Size | 23.3 x 23.3 x 3.2 mm | 23.3 x 23.3 x 3.2 mm | 50 mm x 50 mm |
Weight | 2.5 ±0.1 g | 2.5 ±0.1 g | 10.2 ±0.1 g |
Mounting | Single Side | Single Side | Single Side |
Certifications | CE | CE | CE |
Applications | E-Mobility | E-Mobility | Electric vehicle charging stations |
Learn more | Learn more | Learn more |