RED-BEET 2.0 is a powerline module based on the latest Qualcomm QCA7006AQ PLC chip, which provides SPI and Ethernet interfaces, standard HomePlug GreenPHY support, and a HomePlug AV option for higher data transfer rates. Its extended 105 ºC industrial operating temperature range and AEC-Q100 automotive qualification make it suitable for high-end automotive projects.
RED-BEET 2.0 module
SPI and GPIO connector compatible with Qualcomm PL16 20 pin connector
CN1 Raspberry PI GPIO header
SW4 GPIO_3 button, active low
SW3 Reset button, active low
LEDs for status and activity indication
SW7 ETH/SPI button, set to Ethernet as default
SW5 switch for configuration and bootstrap settings
Ethernet RJ45 connector
EtherUSB Type-C connector for power supply only (5V)
PLC connector
ETH connector
Red BEET 2.0 E
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Red BEET 2.0 P
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Powerline chip | QCA7006AQ | QCA7006AQ |
Firmware version | Qualcomm HomePlug GreenPHY FW v3.3 | Qualcomm HomePlug GreenPHY FW v3.3 |
Configuration | EVSE (Electric vehicle charging stations) | PEV (Plug-in electric vehicles) |
Host Interface | SPI Ethernet (Integrated 10/100 802.3az Ethernet PHY) | SPI Ethernet (Integrated 10/100 802.3az Ethernet PHY) |
Mains Coupling | Yes, for DVK* only | Yes, for DVK* only |
Max data rate | 9.8 Mbps PHY rate / 4.6 Mbps payload with HPGP Firmware 200 Mbps PHY rate / 94 Mbps payload with HPAV Firmware | 9.8 Mbps PHY rate / 4.6 Mbps payload with HPGP Firmware 200 Mbps PHY rate / 94 Mbps payload with HPAV Firmware |
Overvoltage protection | N/A | N/A |
Max distance | According to ISO/IEC 15118-3 | According to ISO/IEC 15118-3 |
Power Supply | 3.3V | 3.3V |
Power Consumption | 1W (at 25º C) | 1W (at 25º C) |
Temperature Range | -40º C to +105º C (board temperature) | -40º C to +105º C (board temperature) |
Size | 23.3 x 23.3 x 3.2 mm | 23.3 x 23.3 x 3.2 mm |
Weight | 2.5 ±0.1 g | 2.5 ±0.1 g |
Mounting | Single Side | Single Side |
Certifications | CE | CE |
Applications | E-Mobility | E-Mobility |